february 2010 doc id 14656 rev 2 1/7 7 emif10-lcd03f3 10-line ipad?, emi filter and esd protection features high attenuation in the mobile frequency range (typically better than -40 db from 900 mhz to 2ghz) very low clamping voltage low line capacitance (30 pf max) suitable for high-speed interfaces maximum rise and fall time: 6 ns (10% - 90%) compliant with high speed data rate lead-free flip chip package in 400 m pitch very thin package: 0.6 mm thickness benefits high efficiency in emi filtering high bandwidth: typically 200 mhz at -3 db 80% space saving versus discrete solution (bom reduction) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 on inputs and outputs ? 15 kv (air discharge) ? 8 kv (contact discharge) applications displays and cameras where outstanding emi filtering in esd sensitiv e equipment is required: mobile phones and pdas personal and home entertainment (portable audio, dvd players, lcd tvs) portable navigation devices digital still cameras portable gaming systems figure 1. pin layout (bump side) figure 2. device configuration description the emif10-lcd03f3 is a 10-line highly integrated lc filter designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the emif10 flip chip package means the package size is equal to the die size. this lc filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 15 kv. tm : ipad is a trademark of stmicroelectronics. flip chip (24 bumps) a b c d e 1 2 3 4 5 o10 i10 o2 o4 o6 o8 i1 i3 i5 i7 i9 gnd gnd gnd o1 o3 o5 o7 o9 i2 i4 i6 i8 gnd input gnd gnd gnd output low-pass filter r i/o = 125 20% c line = 30 pf max 0 0 0 0 www.st.com
characteristics emif10-lcd03f3 2/7 doc id 14656 rev 2 1 characteristics table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp input and output pins: esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 15 15 kv t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input & output c line line capacitance symbol test conditions min typ max unit v br i r = 1 ma 14 v i rm v rm = 3 v per line 200 na r i/o tolerance 20% 100 125 150 c line v line = 0 v, v osc = 30 mv, f =1 mhz 30 pf i v i f i rm i r i pp v rm v f v br v cl
emif10-lcd03f3 characteristics doc id 14656 rev 2 3/7 figure 7. line capacitance versus applied voltage (typical values) figure 3. s21 measurement (all gnd bumps connected) figure 4. analog crosstalk measurements (all gnd bumps connected) 100.0k 1.0m 10.0m 100.0m 1.0g -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 db f (hz) i9-o9 i10-o10 i1-o1 i2-o2 i3-o3 i4-o4 i5-o5 i6-o6 i7-o7 i8-o8 db 100.0k 1.0m 10.0m 100.0m 1.0g -140.00 -130.00 -120.00 -110.00 -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 i1-o2 i1-o10 f (hz) figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) on one line figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) on one line 0 5 10 15 20 25 30 012345 v line (v) f=1 mhz v osc = 30 mv rms t j = 25 c c line (pf)
ordering information scheme emif10-lcd03f3 4/7 doc id 14656 rev 2 2 ordering information scheme figure 10. ordering information scheme figure 8. typical rise and fall time: input voltage figure 9. typical rise a nd fall time: output voltage input voltage x: 10 ns/div y: 1 v/div output voltage x: 10ns/div y: 1v/div t rise 10% -90% = 3.45 ns t fall 90%-10% = 4.09 ns emif yy - xxx zz f3 emi filter number of lines information package x = resistance value (ohm) z = capacitance value / 10 (pf) or 3 letters = application 2 digits = version f = flip chip 3 = lead-free, pitch = 400 m
emif10-lcd03f3 package information doc id 14656 rev 2 5/7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions 605 m 55 1.98 mm 30 m 2.08 mm 30 m 255 m 40 400 m 40 400 m 40 240 m 10 190 m 10 figure 12. footprint figure 13. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year
ordering information emif10-lcd03f3 6/7 doc id 14656 rev 2 figure 14. flip chip tape and reel specification note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip: package description and recommendation for use? an1751: "emi filters: recommendations and measurements" 4 ordering information 5 revision history dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.1 ? 1.55 0.1 0.69 0.05 2.22 0.20 0.02 2.13 st xxz yww st xxz yww st xxz yww table 3. ordering information order code marking package weight base qty delivery mode emif10-lcd03f3 hi flip chip 5.3 mg 5000 tape and reel 7? table 4. document revision history date revision changes 14-apr-2008 1 initial release 19-feb-2010 2 updated pocket dimensions in figure 14 .
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